▎ 摘　　要

NOVELTY - A high-thermal-conductivity foam type thermal interface material comprises graphene filled in the pores of foam. USE - High-thermal-conductivity foam type thermal interface material is used in electronic industries. ADVANTAGE - The high-thermal-conductivity foam type thermal interface material can be prepared economically by a simple and environmentally-friendly method with excellent foaming control, without influencing the inner graphene structure. The high-thermal-conductivity foam type thermal interface material has excellent heat conductivity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of high-thermal-conductivity foam type thermal interface material, which involves uniformly dispersing graphene powder or slurry in a dispersion liquid, and uniformly filling the graphene dispersion in the pores of foam.