▎ 摘　　要

NOVELTY - Ultra-thin conductive adhesive film, comprises a release film and a conductive adhesive layer coated on the release film, where the conductive adhesive layer is composed of 60-75 pts. wt. conductive filler, 25-45 pts. wt. acrylic resin, 5-10 pts. wt. diluent, 3-8 pts. wt. isocyanate curing agent, 0.5-5 pts. wt. silane coupling agent, 2-6 pts. wt. heat stabilizer, 0.5-0.8 pts. wt. photoinitiator, 5-8 pts. wt. 1,3-Bis(oxiranylmethyl)-5-(2-propenyl)-1,3,5-triazine 2,4,6(1H,3H,5H)-trione/terminal amino polyurethane polymer, 2-4 pts. wt. 2,2-bis4-(4-aminophenoxy)phenyl-1,1,1,3,3,3-hexafluoropropane, 1-3 pts. wt. isocyanate ethyl acrylate, 3-6 pts. wt. graphene-coated nano-aluminum powder, and 0.1-0.3 pts. wt. catalyst. USE - Ultra-thin conductive adhesive film used in electronic preparation of electronic product miniaturization, micromation and printed circuit board (PCB). ADVANTAGE - The ultra-thin conductive adhesive film has excellent bonding performance and conductivity, and excellent aging resistance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for an preparation method of ultra-thin conductive adhesive film.