▎ 摘　　要

NOVELTY - A thermal interface material comprises intermediate layer and framework structure located on both sides of the intermediate layer. The framework structure is a metal or alloy framework structure of micro-nano size. The inside of the framework structure is filled with curable organic materials and/or curable inorganic materials. USE - Thermal interface material used in interface connection method to connect electronic devices (claimed). ADVANTAGE - The thermal interface material has a micro/nano metal/alloy framework structure and a curable organic material/inorganic material filling medium. The metal/alloy framework structure is connected to each other, which provides high thermal conductivity. The curable organic materials/inorganic materials are filled between the metal/alloy framework to provide elasticity and support. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) preparation of the thermal interface material, which involves using pulsed laser deposition to form a framework structure on both sides of the intermediate layer, and filling curable organic materials and/or curable inorganic materials into the framework structure; and (2) interface connection method to connect electronic devices, which involves using the thermal interface material to connect pieces to be connected.