• 专利标题:   Air gap glue useful in electromagnetic device, comprises glue substrate, mixed functional material, solvent and additive, where mixed functional material comprises microbeads, and magnetic particles and/or fillers comprising material with thermal conductivity.
  • 专利号:   CN113913140-A
  • 发明人:   GUO H, HOU Q, PENG H
  • 专利权人:   SHENZHEN SUNLORD ELECTRONIC CO LTD
  • 国际专利分类:   C09J011/04, C09J163/00, H01F001/01, H05K009/00
  • 专利详细信息:   CN113913140-A 11 Jan 2022 C09J-163/00 202231 Chinese
  • 申请详细信息:   CN113913140-A CN11366718 18 Nov 2021
  • 优先权号:   CN11366718

▎ 摘  要

NOVELTY - Air gap glue comprises glue substrate, mixed functional material, solvent and additive, where the mixed functional material comprises microbeads, and magnetic particles and/or fillers, the particle size of microbeads (D1) is 5-600 mum, the particle size of magnetic particles (D2) is less than or equal to D1, the particle size of filler (D3) is less than or equal to D1, and the filler is material with thermal conductivity. USE - The air gap glue is useful in an electromagnetic device (claimed). ADVANTAGE - The air gap glue improves the precision of air gap control, and has improved thermal conductivity, magnetic permeability and magnetic shielding capability.