• 专利标题:   Photothermal adhesive composition for fabrication of a microfluidic chip, comprises graphene-transition metal compound composite.
  • 专利号:   US2022080411-A1, KR2022036538-A
  • 发明人:   CHOI H W, LEE J M, KIM Y J, LIM J H, CHUNG B G, JEA K Y, LEE J
  • 专利权人:   UNIV SOGANG RES BUSINESS DEV FOUND
  • 国际专利分类:   B01L003/00, C08K003/04, C09J011/04, C09J171/02, C09J005/06, C09J009/00, C01B032/198, C01G003/12, C09J001/00, C09J005/00
  • 专利详细信息:   US2022080411-A1 17 Mar 2022 B01L-003/00 202248 English
  • 申请详细信息:   US2022080411-A1 US147626 13 Jan 2021
  • 优先权号:   KR118881

▎ 摘  要

NOVELTY - A photothermal adhesive composition comprises graphene-transition metal compound composite. USE - A photothermal adhesive composition for fabrication of a microfluidic chip (claimed). ADVANTAGE - By using the photothermal adhesive composition containing the composite, microfluidic chips that pass fluids through with neither leakage nor deformation can be effectively fabricated. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) manufacture of photothermal adhesive composition which involves reacting graphene with a hydrophilic polymer and then reducing the graphene, and mixing the graphene with transition metal compound nanoparticles to form a composite; and (2) fabrication of a microfluidic chip which involves loading the photothermal adhesive composition to a target site on a microfluidic chip lower substrate, irradiating a laser to the target site, and contacting a microfluidic chip upper substrate with the target site on the lower substrate, followed by irradiating a laser on it.