▎ 摘　　要

NOVELTY - A light weight epoxy electronic packaging material comprises hollow glass microspheres modified by silane coupling agent, graphene oxide solution, organic montmorillonite, talc powder and epoxy resin. USE - Light weight epoxy electronic packaging material used for electronic component e.g. discrete device, large scale integrated circuit (LSI), large scale IC and semiconductor components. ADVANTAGE - The material has graphene oxide modified hollow glass microspheres are used to dispersed in an epoxy resin matrix more uniformly, introducing organic modified montmorillonite and superfine talc powder to form a stable network structure between filler and matrix, and achieved the effect of uniform dispersion of filler.