▎ 摘　　要

NOVELTY - Preparing ultra-thin heat dissipation fin comprises preparing a metal foil with an array pattern on the surface of the metal foil through a nanometer stamping template, depositing a vertical graphene film array on a surface of a metal-radiating fin to form a composite ultra-thinning heat-conducting fin, and depositing an array of vertical graphene films on surface of metal foil by a nano-stamping template. USE - The method is useful for preparing ultra-thin radiating fin, which is used in electronic device, and integrated circuit (IC). ADVANTAGE - The method amplifies the radiating area of the radiating fin and improves radiating efficiency of the fin. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for ultra-thin radiating fin prepared by above mentioned method.