▎ 摘　　要

NOVELTY - Providing electrostatic discharge (ESD) protection in an electrical device, comprises: a first electrically-conductive carbon allotrope; a second electrically-conductive carbon allotrope; and an electrically-conductive polymer that is chemically bonded to the first and second electrically-conductive carbon allotropes so that an electrical signal may pass between the first and second electrically-conductive carbon allotropes. USE - The method is useful for providing electrostatic discharge protection in an electrical device. ADVANTAGE - The method: improves electron transport in the composite when the voltage (e.g. the ESD) has reached a triggered voltage; utilizes intrinsically-conductive polymers that may be reversibly doped/dedoped to transition from a conductive state to a non-conductive state, which may allow for specific tuning of the ESD voltage range; and utilizes the intrinsically-conductive polymers that may lower the trigger-voltage, while 2-dimentional materials including the above-described carbon allotropes may improve conduction pathways at a lower percolation threshold. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: forming a microelectronic package for use in an electronic device, comprising identifying a ground path that electrically couples a signal path and a ground connection in a substrate of the microelectronic package, and positioning ESD protection material in the ground path between the signal path and the ground connection, that includes two electrically-conductive carbon allotropes that are electrically coupled with one another by a first electrically-conductive polymer that is chemically functionalized with the electrically-conductive carbon allotropes, and a non-conductive polymer matrix that is chemically functionalized with the electrically-conductive carbon allotropes by a second electrically-conductive polymer. (1) a microelectronic package (100) for use in an electronic device, comprising a signal path electrically positioned between, and coupled to a die (105) and a voltage input, a ground signal path electrically positioned between, and coupled to a connection to ground and the signal path, and an ESD protection material (145) coupled to the ground signal path, where the ESD protection material includes the first electrically-conductive carbon allotrope, a second electrically-conductive carbon allotrope and an electrically-conductive polymer that chemically bonds the first and second electrically-conductive carbon allotropes to one another within a non-conductive material; and DESCRIPTION OF DRAWING(S) - The figure shows a schematic view of microelectronic package with ESD protection material. Microelectronic package (100) Die (105) Package substrate (110) Interconnect (115) Electrostatic discharge protection material (145)