▎ 摘　　要

NOVELTY - A chip type conductive polymer tantalum capacitor comprises anode tantalum block (1), dielectric layer (2), bonding guide layer (3), conductive polymer cathode layer (4), graphene composite material layer (5), graphite silver paste layer (6), moisture-proof barrier layer (7), packaging shell (8), positive lead (9) and negative lead (10). The positive electrode lead is electrically connected to the anode tantalum block, and the negative electrode lead is electrically connected to the graphite-silver paste layer to form a tantalum core group. The moisture-proof barrier layer is coated on the outside of the tantalum core group. The tantalum core group covering the moisture-proof barrier layer is packaged and arranged in the package shell. The positive lead is led out from one side of the encapsulation shell to the outside of the epoxy resin shell. The negative lead is led out from the other side of the package to the outside of the package. USE - Chip type conductive polymer tantalum capacitor. ADVANTAGE - The chip-type conductive polymer tantalum capacitor has high bonding force, high mechanical strength, high performance stability for long time thermoelectric stress, and enhanced stability and reliability. DETAILED DESCRIPTION - A chip type conductive polymer tantalum capacitor comprises anode tantalum block, dielectric layer, bonding guide layer, conductive polymer cathode layer, graphene composite material layer, graphite silver paste layer, moisture-proof barrier layer, packaging shell, positive lead and negative lead. The outer surface of the anode tantalum block is sequentially covered with the dielectric layer, the bonding guide layer, the conductive polymer cathode layer, the graphene composite material layer and the graphite silver paste layer from the inside to the outside. The positive electrode lead is electrically connected to the anode tantalum block, and the negative electrode lead is electrically connected to the graphite-silver paste layer to form a tantalum core group. The moisture-proof barrier layer is coated on the outside of the tantalum core group. The tantalum core group covering the moisture-proof barrier layer is packaged and arranged in the package shell. The positive lead is led out from one side of the encapsulation shell to the outside of the epoxy resin shell. The negative lead is led out from the other side of the package to the outside of the package. An INDEPENDENT CLAIM is included for a preparation of a chip conductive polymer tantalum capacitor, which involves (1) immersing the anode tantalum block with the tantalum pentoxide film formed on the surface after energization into the guiding layer treatment solution (A) for 1-15 minutes, and drying and forming at 50-150degrees Celsius, (2) immersing the anode tantalum block obtained in the step (1) in a poly (3,4-ethylenedioxythiophene) particle dispersion with a solid content of 0.5-2.5% and an average particle size of 20-30 nm under vacuum for 1-10 minutes, and drying in a vacuum environment of 80-150degrees Celsius, repeating the step for 5-15 times, (3) immersing the anode tantalum block obtained in the step (2) in a poly (3,4-ethylenedioxythiophene) particle dispersion with a solid content of 1-5% and an average particle size of 30-50 nm under vacuum for 1-10 minutes, and drying in a vacuum environment of 80-150degrees Celsius, repeating the step for 2-8 times, (4) immersing the anode tantalum block obtained in the step (3) in a poly (3,4 ethylenedioxythiophene) particle dispersion with a solid content of 2-10% and an average particle size of 50-100 nm under vacuum for 1-10 minutes, and drying in a vacuum environment of 80-150degrees Celsius, immersing the dried anode tantalum block in the cross-linking agent (B) under normal pressure for 1-5 minutes, and drying at 80-150degrees Celsius, and repeating the step for 2-6 times, (5) immersing the anode tantalum block obtained in the step (4) in a graphene composite material system (C) with a solid content of 0.05-5% and a particle size of 50-500 nm, and carrying out drying at 120-150degrees Celsius, and repeating the step for 1-2 times to obtain an anode tantalum block with a conductive polymer outer layer containing a graphene structure, (6) impregnating the conductive polymer outer layer of the anode tantalum block obtained in the step (5) with graphite and silver paste to form a graphite silver paste layer, and then drawing out the positive and negative electrodes with a lead frame to obtain a tantalum core group, and (7) coating the moisture-proof barrier layer (D) on the tantalum core group obtained in the step (6), and molding and packaging. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic cross-sectional view of a chip-type conductive polymer tantalum capacitor. Anode tantalum block (1) Dielectric layer (2) Bonding guide layer (3) Conducting polymer cathode layer (4) Graphene composite material layer (5) Graphite silver paste layer (6) Moisture-proof barrier layer (7) Packaging shell (8) Positive lead (9) Negative lead (10)