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  • 专利标题:   Manufacturing component carrier comprises providing laminated stack having electrically conductive layer structure and/or electrically insulating layer structure, at least partially covering component with transition layer and assembling component with stack , Manufacturing component carrier comprises providing laminated stack having electrically conductive layer structure and/or electrically insulating layer structure, at least partially covering component with transition layer and assembling component with stack.
  • 专利号:   US2021227702-A1, CN113163572-A, EP3855487-A1
  • 发明人:   TUOMINEN M, TAY S K, LIU K, BAFTIRI A, GUO H, ZHENG X, LIU Q, GUO Z
  • 专利权人:   AT S CHINA CO LTD, AT S CHINA CO LTD
  • 国际专利分类:   H05K001/18, H05K001/02, H05K003/46, H01L023/492, H05K003/00, H05K003/22, H05K003/28, H01L023/538
  • 专利详细信息:   US2021227702-A1 22 Jul 2021 H05K-003/46 202177 English
  • 申请详细信息:   US2021227702-A1 US139871 31 Dec 2020
  • 优先权号:   CN10073861

▎ 摘　　要

NOVELTY - Manufacturing a component carrier (100) comprises: providing a laminated stack (102) having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; at least partially covering a component with a transition layer (110) having a thickness of 0.5-1 microm; and assembling the component with the stack. USE - The method is useful for manufacturing a component carrier. ADVANTAGE - The method: improves the freedom to embed different sizes and shapes of components; improve a stress distribution by inducing improvement upon high thermal, mechanical and electrical properties; enable the design of packages with very high adhesion properties to encapsulated components; improves reliability improvement, preferably thermal reliability, chemical reliability, mechanical reliability and/or electrical reliability; provides high achievable yield and a high freedom of selecting appropriate materials; achieves a reliable behavior even in a harsh environment; avoids stress concentration and crack propagation and a path for electrochemical migration; and increases the adhesion and thus the reliability. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a component carrier. DESCRIPTION OF DRAWING(S) - The figure shows a cross-sectional view of a component carrier with an embedded component covered with a transition layer. Component carrier (100) Stack (102) Electrically insulating layer structures (106) Embedded component (108) Transition layer (110)