▎ 摘　　要

NOVELTY - A composition comprises a terphenyl skeletal compound with two or more oxiranyl, a curing agent, and a planar inorganic filler. The inorganic filler is surface-treated. USE - Composition used for forming material for electronic component (all claimed). Uses include but are not limited to heat-dissipating plate, heat-dissipating sheet, heat-dissipating film, heat-dissipating coating film, heat-dissipating adhesive, and heat-dissipating molded product. ADVANTAGE - The composition is easy to handle, and has excellent chemical stability, heat resistance, hardness and mechanical strength and high thermal conductivity. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: material for electronic component, which is obtained by curing the composition; and electronic components, which comprises the material for electronic component, and an electronic device comprising a heat generating portion. The material for electronic component is arranged in the electronic device so as to be in contact with the heat generating portion.