▎ 摘　　要

NOVELTY - A carrier comprises stack (102) having front side (104) and back side (106), and including stacked electrically insulating layer structures (108); through hole (110) being narrower in inner portion (185) compared to exterior portions (187, 189) and extending through electrically insulating layer structures, where sidewalls of each of electrically insulating layer structures delimit respective parts of through hole; and electrically conductive filler (112) filling the through hole. USE - The carrier including printed circuit board, organic interposer, integrated circuit or hybrid board is used for an inlay e.g. metal inlay comprising copper or aluminum; heat transfer unit e.g. heat pipe; light guiding element e.g. optical waveguide or light conductor connection; electronic component including electronic chip, storage device e.g. dynamic RAM, filter, integrated circuit, signal processing component, power management component, optoelectronic interface unit, LED, photocoupler, voltage converter, cryptographic component, transmitter and/or receiver, electromechanical transducer, sensor, actuator, microelectromechanical system, microprocessor, capacitor, resistor, inductance, battery, switch, camera, antenna, logic chip, and energy harvesting unit; and/or magnetic unit including permanent magnetic unit e.g. ferromagnetic unit, antiferromagnetic unit, multiferroic unit or ferrimagnetic unit, preferably ferrite core, or paramagnetic unit. ADVANTAGE - The carrier has refined electric connection function and improved thermal performance, mechanical stability and electric reliability. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method of manufacturing the carrier. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the carrier. Stack (102) Front side (104) Back side (106) Electrically insulating layer structures (108) Electrically conductive filler (112) Inner portion (185) Exterior portions (187, 189)