▎ 摘　　要

NOVELTY - Preparing high thermal conductivity and low dielectric epoxy composite material involves (1) preparing the polyimide, (2) dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers with a mass ratio of 9:1 to 8:2 in a solvent, stirring for 1-3 hours at room temperature to 60 ℃ for hybridization assembly, then separating and washing to obtain polyimide hybrid microsphere, and (3) uniformly mixing the 3-20 pts. wt. polyimide microsphere with 100 pts. wt. epoxy resin, and adding 15-25 pts. wt. curing agent, curing at 25-160 ℃ to obtain the epoxy composite material with high heat-conducting and low dielectric. USE - Method for preparing high thermal conductivity and low dielectric epoxy composite material used in the electronic packaging field. ADVANTAGE - The preparation method has simple and easy to realize large-scale application, the prepared composite material has high heat conductivity, low dielectric, high strength, electric insulation, high temperature resistance, and light weight. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for the high thermal conductivity and low dielectric epoxy composite material.