• 专利标题:   Conductive ink used for preparing electroplated plastic, comprises water-based resin binder, conductive filler, swelling agent and solvent.
  • 专利号:   CN116120785-A
  • 发明人:   ZHENG N, SUN J, SHAO Z, WU B
  • 专利权人:   TAN KAH KEE INNOVATION LAB, UNIV XIAMEN
  • 国际专利分类:   C08J007/044, C08L101/00, C09D011/03, C09D011/102, C09D011/107, C09D011/52, C25D005/56
  • 专利详细信息:   CN116120785-A 16 May 2023 C09D-011/52 202352 Chinese
  • 申请详细信息:   CN116120785-A CN11698818 28 Dec 2022
  • 优先权号:   CN11698818

▎ 摘  要

NOVELTY - A conductive ink comprises 5-50 pts. wt. water-based resin binder, 1-40 pts. wt. conductive filler, 1-50 pts. wt. swelling agent and 1-50 pts. wt. solvent. USE - The conductive ink is used for preparing plastic material, which is used for preparing electroplated plastic (all claimed) and for printing conductive points or conductive lines. ADVANTAGE - The conductive ink has good conductivity and good binding force. The electroplated plastic prepared using the conductive ink has good coating binding force, electrical conductivity, film layer uniformity, salt spray resistance and cold and heat shock resistance. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: a method for preparing the conductive ink comprising mixing the raw materials of the conductive ink; a method for preparing a plastic material comprising providing a plastic substrate and the conductive ink, coating the conductive ink on the surface of the plastic substrate, and drying; the plastic material obtained by the above method comprising a plastic substrate and an ink layer formed on the surface of the plastic substrate; and an electroplated plastic comprising the plastic material and at least one metal plating layer, where the metal plating layer is formed on the side of the ink layer away from the plastic substrate, the metal of the metal plating layer is one or more of gold, silver, molybdenum, rhodium, palladium, copper, iron, tin, zinc, cobalt, nickel, chromium, cadmium, antimony, indium and bismuth.