▎ 摘　　要

NOVELTY - Circuit board comprises base layer (10); and two first wiring layers disposed on two opposite surfaces of the base layer, each of the two first wiring layers comprising first bottom wiring formed on the base layer, the first bottom wiring comprising a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end; and first electroplated copper wiring covering the second end and the first sidewall of the first bottom wiring. USE - Printed circuit board for electronic devices, such as mobile phones, tablet computers, or personal digital assistants. ADVANTAGE - The circuit board is provided with fine wiring. The method for manufacturing the circuit board can avoid the undercut in the copper wirings, the copper electroplating process can also cause pollution in the environment. The fine wiring is formed on the copper foil of the copper substrate through the etching process, so as to prevent the undercut from occurring in the wiring layer. The copper foil is formed in the opening of the dry film, so that the fine wiring can be formed without using the electroplated copper, thus, the waste of copper can be avoided, and the pollution of the environment can be reduced. Thus, the manufacturing cost can be saved and the manufacturing process can be simplified. The manufacturing time can be shortened and the productivity can be improved. The production cost can also be saved. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of base layer. 10Base layer 11Hole