▎ 摘　　要

NOVELTY - Electromagnetic interference (EMI) shielding material comprises a biopolymer or polymer, dissolved in organic solvents, and shielding guest materials, where the shielding guest materials comprises at least one of particles, powders, tubes or rods, flakes, fiber or sheets. USE - The material is useful for electronics, telecommunications, and aviation for EMI shielding applications on electronic devices and circuit boards. ADVANTAGE - The material has high EMI shielding efficiency, nonconductivity, makes a single EMI shielding layer on top of and in direct contact with electronic circuit boards possible, is spreadable (with liquid phase BESM), conformable, compatible with the shapes and most object materials, such as metals, glass and plastic and economical, and has large thermal conductivity that could dissipate heat generated by high-speed electronics. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) a method (A) of making an EMI shielding material involving dissolving DNA or RNA in a first amount of de-ionized water for a first period of time to form a DNA or RNA solution, dissolving a surfactant in a second amount de-ionized water for a second period of time to form a surfactant solution, making a DNA or RNA-surfactant complex by adding the DNA or RNA solution to the surfactant solution, thereby causing a DNA or RNA-surfactant precipitate to form, making an organic solvent-based DNA or RNA surfactant solution by dissolving the DNA or RNA-surfactant precipitate in an organic solvent, and making the EMI shielding material by mixing shielding guest materials, where the shielding guest materials comprises at least one of particles, powders, tubes or rods, flakes, fiber or sheets, with the organic solvent based DNA or RNA-surfactant solution, finally crosslinking the EMI shielding material if required; (2) a method (B) for making an EMI shielding material film involving producing the EMI shielding material film by forming the EMI shielding material into a film by one of at least one of casting, spin depositing, spray coating, ink jet printing, vapor deposition, molecular vapor deposition or embossing.