▎ 摘　　要

NOVELTY - The present invention discloses a heat dissipation structure and an electronic device. The heat dissipation structure is in contact with a heat source. The heat source includes a heat generating element disposed on a first surface of a carrier. The heat dissipation structure includes a first heat dissipation module. The first heat dissipation module is disposed on the top surface of the heat generating element. Wherein, the first heat dissipation module includes at least one heat dissipation unit. The at least one heat dissipation unit is a single-layer or multi-layer body composed of graphite layer, graphene layer, thermally conductive metal layer, thermally conductive adhesive layer, or their combination. Wherein, the side of the first heat dissipation module protrudes from the top surface of the heat generating element, and does not contact with the first surface of the carrier. The heat dissipation structure and the electronic device of the present invention can achieve excellent heat dissipation performance.