▎ 摘　　要

NOVELTY - Apparatus has a heat dissipation device (140) thermally coupled to an integrated circuit device, where the heat dissipation device comprises an isotropic thermally conductive section and an anisotropic thermally conduction section. A thermal interface material contacts the anisotropically conductive sections and the integrated circuit devices. The anisropic conductivity section comprises a set of carbon nanorods and carbon nanotubes embedded in a thermally insulative material e.g. graphene sheets. The integrated circuit has a surface electrically attached to a substrate (120). USE - The apparatus is useful for removing heat from integrated circuit devices. ADVANTAGE - The performance, lower cost, increased miniaturization of integrated circuit components, and greater packaging density of integrated circuits are achieved. The heat is removed from the multiple integrated circuit devices with a single thermally conductive heat dissipation device, such as a heat spreader. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an electronic system. DESCRIPTION OF DRAWING(S) - The figure shows a side cross-sectional view of the integrated circuit package including a heat dissipation device comprising anisotropic thermally conductive sections and isotropic thermally conductive sections. Integrated circuit package (100) Integrated circuit device (110) First surface (112) Substrate (120) Heat dissipation device (140)