• 专利标题:   Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.
  • 专利号:   WO2023062325-A1, FR3128223-A1
  • 发明人:   PRENVEILLE T
  • 专利权人:   ARKEMA FRANCE, BOSTIK SA, ARKEMA FRANCE, BOSTIK SA
  • 国际专利分类:   C09J177/06, B29C045/14, C08K003/04, C09D177/00, C09J011/04, C09J177/00, H05K007/00
  • 专利详细信息:   WO2023062325-A1 20 Apr 2023 C09J-177/06 202334 Pages: 36 French
  • 申请详细信息:   WO2023062325-A1 WOFR051931 13 Oct 2022
  • 优先权号:   FR010897

▎ 摘  要

NOVELTY - Hot melt adhesive composition comprises (i) at least one aliphatic semi-crystalline copolyamide comprising at least two units corresponding to X/Y (1), where unit X is a semi-crystalline unit obtained by polycondensation of unit comprising α , ω -aminocarboxylic acid in 6-18C, lactam in 6-18C and unit (diamine in Ca), (Cb diacid) with a representing the number of carbon atoms of the diamine, where b represents carbon number of diacid i.e., 2-18 and b is 4-18, Ca diamine and Cb diacid is linear or branched aliphatic, cycloaliphatic, saturated or unsaturated, the unit Y is a unit obtained by the polycondensation of a unit (Cd diamine, Cd diamine and Ce diacid is aliphatic linear or branched, cycloaliphatic, saturated or unsaturated, Cd diamine possibly is polyether amine, unit Y having a Tg of less than 30° C, preferably less than 0° C, and (ii) 3-35 wt.% at least one thermally conductive filler, whose carbon atom content is 80-100% relative to the number of atoms constituting filler. USE - The composition is useful for encapsulating electronic devices, preferably located under the bonnet of a vehicle or in medical devices (claimed). ADVANTAGE - The composition exhibits good electrically insulating and thermally conductive properties, exhibits stability over time in molten state, and is easy to implement at low pressure. DETAILED DESCRIPTION - Hot melt adhesive composition comprises (i) at least one aliphatic semi-crystalline copolyamide comprising at least two units corresponding to X/Y (1), where unit X is a semi-crystalline unit obtained by polycondensation of unit comprising α , ω -aminocarboxylic acid in 6-18C, lactam in 6-18C and unit (diamine in Ca), (Cb diacid) with a representing the number of carbon atoms of the diamine, where b represents carbon number of diacid i.e., 2-18 and b is 4-18, Ca diamine and Cb diacid is linear or branched aliphatic, cycloaliphatic, saturated or unsaturated, the unit Y is a unit obtained by the polycondensation of a unit (Cd diamine), (Ce diacid) with d represents the number of carbon atoms of the diamine and e representing the carbon number of diacid, d and e is 2-48, Cd diamine and Ce diacid is aliphatic linear or branched, cycloaliphatic, saturated or unsaturated, Cd diamine possibly is a polyether amine, unit Y having a Tg of less than 30° C, preferably less than 0° C, copolyamide having a melt viscosity measured according to the standard of 0.5-300 Pa-s at 200° C, copolyamide constituting the matrix of the composition, (ii) 3-35 wt.% at least one thermally conductive filler, whose carbon atom content is 80-100% relative to the number of atoms constituting the filler, and composition comprises less than 20% of its components having a specific gravity greater than 3.