• 专利标题:   Cooling device for suppressing adhesion of small pieces of graphite sheet to circuit board, has shielding portion that is provided at position between portion of circuit board where no heat-generating component is mounted.
  • 专利号:   US2021378086-A1, JP2021190598-A
  • 发明人:   BABA Y
  • 专利权人:   DENSO CORP, DENSO CORP
  • 国际专利分类:   H05K007/20, H05K001/02, H01L023/36
  • 专利详细信息:   US2021378086-A1 02 Dec 2021 H05K-001/02 202202 English
  • 申请详细信息:   US2021378086-A1 US331700 27 May 2021
  • 优先权号:   JP095728

▎ 摘  要

NOVELTY - The device has a heat-generating component mounted on a circuit board (8). An external heat dissipater is provided to dissipate heat to outside fof the cooling device. A graphite sheet (4) contains graphene, which is integrally provided on a surface of the external heat-dissipater. A heat conductive portion (5) contacts both a portion of the sheet and the component and has thermal conductivity capable of transferring heat from the component to the sheet. A shielding portion (6) is provided at a position between a portion of the circuit board and the sheet. USE - Cooling device for transferring heat from heat-generating components mounted on circuit board to graphite sheet for heat dissipation. ADVANTAGE - The device suppresses adhesion of small pieces of graphite sheet to a circuit board. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the graphite sheet and the shielding portion. Graphite sheet (4) Heat conductive portion (5) Shielding portion (6) Electronic component (7) Circuit board (8)