▎ 摘　　要

NOVELTY - The method involves performing (a) a first material removing process on a flexible substrate. The resulting first material removed regions on the substrate are covered (b) by cover films. A second material removing process is performed (c) on the substrate, forming second material removed regions on the films. A heat sink of graphene is disposed (d) on the back side of the substrate. LED dies are disposed (e), after which the first conducting section and second conducting section of the substrate are connected (f). Positive and negative wires are connected (g) to power and excite the dies. USE - Manufacturing method for LED heat dissipating substrate such as used for liquid crystal display (LCD) back lights, mobile phone backlights, signal lights, vehicles, art illumination, building illumination, stage lighting control, and family illumination. ADVANTAGE - Enables to provide a LED heat dissipating substrate, which can be curved and curled, and which has the unlimited length and can be manufactured continuously without the conventional electro-plating and etching processes, thus omitting water cleaning and avoiding waste water generation. Since the graphene heat sink is used instead of aluminum, no waste water is produced to reduce carbon dioxide, thus realizing energy savings and carbon reduction. DESCRIPTION OF DRAWING(S) - The drawing shows the flowchart of a LED heat dissipating substrate manufacturing method. Performing first material moving process (a) Covering substrate using cover films (b) Performing second material removing process (c) Disposing heat sink on back side of substrate (d) Disposing LED dies (e) Connecting conducting sections (f) Connecting positive and negative wires to power and excite LED dies (g)