▎ 摘　　要

NOVELTY - Chemical-mechanical polishing solution comprises 2-20 wt.% grinding agent, 0.5-5 wt.% oxidant, 0-0.01 wt.% tungsten catalyst, 0-0.05 wt.% point corrosion inhibitor and deionized water (remaining amount). The point corrosion inhibitor is compound containing hydroxy functional group closely packed with carbon atom linked by SP2 hybridization, or hydroxylated graphene and/or hydroxylated carbon nanotube. The grinding agent is fumed silica, preferably commercial electronic grade fumed silica. The oxidant is hydrogen peroxide, potassium persulfate, ammonium persulfate, sodium hypochlorite and/or potassium hypochlorite, preferably hydrogen peroxide. The tungsten catalyst is an iron salt, preferably iron nitrate. The de-ionized water is ultra-pure water. USE - The chemical-mechanical polishing solution is useful for tungsten (claimed) plug. ADVANTAGE - The polishing solution has fast polishing speed, good surface quality and excellent stability.