▎ 摘　　要

NOVELTY - Heat dissipation composite composition comprises: epoxy resin, and a first phase change material, and includes a polymer matrix formed by chemical bonding of the epoxy resin and the first phase change material; or 20-75 pts. wt. of at least one phase change material based on 100 pts. wt. of the composition, 10-30 pts. wt. of an epoxy resin, 1-10 pts. wt. of a curing agent, and 10-55 pts. wt. of a heat dissipating filler. USE - The composition is used for forming a heat dissipation composite, and is used for heating and cooling applications, heat sinks of electronic products, living industries such as clothing, and food industries, and is used for applying to electronic products operated under high temperature conditions. The electronic products include as a housing of a heat-generating component material, an interface plate material, and/or a heat control material of a battery system. ADVANTAGE - The composition is capable of exhibiting high latent heat characteristics and thermal conductivity characteristics and excellent leakage characteristics. The composition is applied to various fields requiring latent heat properties and/or heat dissipation properties without risk of leakage due to phase change. The heat dissipation composite is effectively applied under high-temperature conditions. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for producing a heat dissipation composite composition, comprising (i) forming a mixture by melting and stirring an epoxy resin, a first phase change material, and a curing agent, and then pre-curing the mixture at a temperature equal to or higher than the curing temperature of the epoxy resin to prepare a first cured product, and (ii) secondary main curing of the first cured product.