▎ 摘　　要

NOVELTY - A semiconductor package (101) comprises a bottom die (d1) (121a), a bottom die (d2) (121b) on a package substrate, top die(s) (t1) on the bottom die (d1), top die(s) (t2) on the bottom die (d2), thermally conductive slug(s) (140) on the bottom die (d1) and the bottom die (d2), an encapsulation layer over the bottom dies (d1) and (d2), and a thermal interface material (TIM) over the top die(s) (t1), the top die(s) (t2), the thermally conductive slugs, and the encapsulation layer. The bottom die (d1) is adjacent to the bottom die (d2). The thermally conductive slug(s) comprises a high thermal conductive material and containing thermally conductive slugs (s1) and a thermally conductive slug (s2). The encapsulation layer surrounds the top die(s) (t1), (t2), and the thermally conductive slug. USE - Package used for semiconductor device such as integrated circuit. Uses include but are not limited to such as microelectromechanical system (MEMS) based electrical system, gyroscope, advanced driving assistance system (ADAS), camera, cell phone, computer terminal, desktop computer, electronic reader, netbook computer, notebook computer, personal digital assistant, media player, smart phones, tablet personal computer, ultra-mobile personal computer, and wired telephone. ADVANTAGE - The semiconductor package has reduced the top die thickness can slightly reduced the hotspot temperature, removed the hotspots generated by the high power and high density bottom dies, and has increased thermal design power. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the semiconductor package. Semiconductor package (101) Pedestal (120) Bottom Dies (121a,121b) Interconnects (131) Thermally conductive slugs (140)