▎ 摘　　要

NOVELTY - Processing substrate hole comprises (a) pre-washing the substrate, (b) soaking the pre-washed substrate in the prepared graphene dispersion liquid, (c) immersing the graphene dispersive liquid in the hole structure, (d) ultrasonically treating, and drying to obtain conductive layer for direct plating, and (e) the graphene dispersion comprises water, graphene and macromolecular dispersant, where the graphene and macromolecular dispersant are in conjugate system. USE - The method is useful for processing substrate hole, which is also used in directly plating circuit board based on graphene film used in electronic system product e.g. printed circuit board (PCB). ADVANTAGE - The graphene dispersion liquid reduces dispersion of liquid graphene material on the base plate hole structure after the thickness difference is large to generate the gap, improves dispersibility of graphene, improves interaction force between the graphene and water-soluble polymer, improves adhesive force of the conductive layers and hole structure, and has good uniformity, stable property and good compactness. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for circuit board processed by the substrate hole processing method.