▎ 摘　　要

NOVELTY - The method involves adhering (S1) graphene on heat release adhesive tape. Graphene surface of heat release adhesive tape is bonded (S2) with boron nitride. The heat release adhesive tape is heated and removed to obtain graphene-boron nitride hetero-junction. Substrate comprises copper, nickel or platinum. USE - Method for preparing graphene-boron nitride hetero-junction. ADVANTAGE - The process for preparing graphene-boron nitride hetero-junction is simplified, and quality of prepared graphene-boron nitride hetero-junction is improved effectively. DESCRIPTION OF DRAWING(S) - The drawing shows a flowchart illustrating the process for preparing graphene-boron nitride hetero-junction. (Drawing includes non-English language text) Step for adhering graphene on heat release adhesive tape (S1) Step for bonding graphene surface of heat release adhesive tape with boron nitride (S2) Step for heating and removing heat release adhesive tape to obtain graphene-boron nitride hetero-junction (S3)