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  • 专利标题:   Resin composition comprises epoxy resin, bisphenol A, phenolic resin and inorganic filler, inorganic filler comprises metal oxide, metal nitride, metal carbide, and/or graphene in metal hydroxide.
  • 专利号:   CN111040383-A
  • 发明人:   LIN C, CAI X, YANG G, LIANG Y, GAO Y, SU J
  • 专利权人:   GUANGDONG QUANBAO TECHNOLOGY CO LTD
  • 国际专利分类:   B32B015/092, B32B015/098, B32B015/18, B32B027/06, B32B027/20, B32B027/38, B32B027/42, C08K003/013, C08K003/04, C08K003/22, C08K003/28, C08K003/34, C08K003/38, C08L061/06, C08L063/00, C09K005/14
  • 专利详细信息:   CN111040383-A 21 Apr 2020 C08L-063/00 202040 Pages: 7 Chinese
  • 申请详细信息:   CN111040383-A CN11380030 27 Dec 2019
  • 优先权号:   CN11380030

▎ 摘　　要

NOVELTY - Resin composition comprises epoxy resin, bisphenol A, phenolic resin and inorganic filler, the inorganic filler comprises a metal oxide, a metal nitride, a metal carbide, and/or graphene in metal hydroxide. USE - Used as resin composition. ADVANTAGE - The composition: has high thermal conductivity, good adhesion, thermal conductivity, coating properties, and insulation properties. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for high heat-resistant metal-based copper clad laminate comprising at least one insulating layer, and the insulating layer is made of highly thermally conductive resin composition.