• 专利标题:   Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.
  • 专利号:   CN114806078-A
  • 发明人:   CHEN K, YU D
  • 专利权人:   ITEQ WUXI ELECTRONICS TECHNOLOGY CORP
  • 国际专利分类:   B32B015/14, B32B015/20, B32B017/02, B32B017/06, B32B033/00, C08J005/04, C08K005/5313, C08K007/14, C08K007/18, C08L063/00, C08L079/08, H05K001/03
  • 专利详细信息:   CN114806078-A 29 Jul 2022 C08L-063/00 202291 Chinese
  • 申请详细信息:   CN114806078-A CN10060714 18 Jan 2021
  • 优先权号:   CN10060714

▎ 摘  要

NOVELTY - Low-expansion coefficient halogen-free resin composition comprises (a) 30-40 pts. wt. o-cresol formaldehyde epoxy resin, (b) 50-70 pts. wt. bismaleimide resin, (c) 75-105 pts. wt. cyanate ester hardener, (d) 30-45 pts. wt. bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener, (e) 10-20 pts. wt. non-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide phosphorus-containing flame retardant, and (f) 2-12 pts. wt. 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide flame retardant, where the 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide flame retardant is e (I) and (II). USE - The low-expansion coefficient halogen-free resin composition is useful in laminate for printed circuit board (all claimed). ADVANTAGE - The low-expansion coefficient halogen-free resin composition: can provide epoxy resin composition with low expansion coefficient and low dielectric loss and high rigidity, and provides excellent toughness and heat resistance. DETAILED DESCRIPTION - Low-expansion coefficient halogen-free resin composition comprises (a) 30-40 pts. wt. o-cresol formaldehyde epoxy resin, (b) 50-70 pts. wt. bismaleimide resin, (c) 75-105 pts. wt. cyanate ester hardener, (d) 30-45 pts. wt. bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener, (e) 10-20 pts. wt. non-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide phosphorus-containing flame retardant, and (f) 2-12 pts. wt. 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide flame retardant, where the 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide flame retardant is of formulae (I) and (II). R1= C(R4)2; Either R2, R3= hydrogen, 1-15C alkyl, 6-12C aryl, 7-15C aryl alkyl or 7-15C alkyl aryl; Or R2, R3= form 1-6C alkyl saturated or unsaturated cyclic ring (optionally substituted); R4= hydrogen, 1-6C alkyl, 6-12C aryl or 3-12C cycloalkyl; m = 1-4; A = direct bond, 6-12C aryl, 3-12C cycloalkyl or 3-12C cycloalkenyl; Cycloalkyl or cycloalkenyl = optionally substituted by 1-6C alkyl; Either R1-R4= hydrogen, 1-15C alkyl, 6-12C aryl, 7-15C aryl alkyl or 7-15C alkyl aryl; Or R1-R4= can form 1-6C alkyl saturated or unsaturated cyclic ring (optionally substituted); m = 1-4; R5, R6= hydrogen or 1-6C alkyl; and n = 0-5. An INDEPENDENT CLAIM is also included for laminate comprising a resin substrate including plurality of prepreg sheets, and each of the prepreg sheets is made of glass fiber cloth coated with low-expansion coefficient halogen-free resin composition and metal foil layer disposed on at least one surface of the resin substrate.