• 专利标题:   Graphene substrate useful for semiconductor chip, has graphene layer which is folded, and metal layer which covers surface of graphene layer.
  • 专利号:   CN115101486-A
  • 发明人:   CAO L, CHEN C, MA R
  • 专利权人:   NAT CENT ADVANCED PACKAGING CO LTD
  • 国际专利分类:   H01L021/48, H01L023/367, H01L023/373
  • 专利详细信息:   CN115101486-A 23 Sep 2022 H01L-023/367 202293 Chinese
  • 申请详细信息:   CN115101486-A CN10765483 30 Jun 2022
  • 优先权号:   CN10765483

▎ 摘  要

NOVELTY - Graphene substrate comprises a graphene layer, which is folded, and a metal layer, which covers the surface of the graphene layer. USE - Graphene substrate is useful for semiconductor chip (claimed). ADVANTAGE - The graphene substrate can be used as the substrate of the semiconductor chip with high power consumption or high heat flow density. The folded graphene layer can realize the heat transfer in the horizontal and vertical direction, and can reduce the thermal resistance of the chip, enhance the radiating effect. The other metal layer can be connected with the welding component in the chip and solves the problem that the graphene material cannot be welded. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for method for constructing the graphene substrate. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic structural diagram of a graphene substrate.