▎ 摘　　要

NOVELTY - The board has an aluminum-based bottom plate layer whose lower surface is provided with a graphene insulating heat-conducting layer. An upper surface of the aluminum-by-bottom plate layer is formed with a copper conductive circuit layer. The aluminum-top substrate layer is connected with the copper conductivity circuit layer through heat-pressing. The copper-based substrate layer comprises a copper insulating layer and a copper-conductive insulating insulation layer. USE - High heat-conducting aluminum-based circuit board. ADVANTAGE - The high heat-conducting aluminum base circuit board ensures good heat conducting performance, at the same time, ensuring the insulating performance. The aluminum base plate layer, graphene insulating heat conducting layer, copper conductive circuit layer, and copper conductor circuit layer are constructed at 3-4 MPa, 90-90??C under the condition of heat preservation for 15 minutes. The normal working process of the circuit board is ensured. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) preparing high heat-conducting aluminum-based circuit board; (2) circuit board punching device. DESCRIPTION OF DRAWING(S) - The drawing shows a flow chart of a high heat-conducting aluminium-based circuit board. (Drawing includes non-English language text).