• 专利标题:   Manufacturing technique of graphene chip packaging structure involves preparing packaging shell and two metal plates, spraying insulating coating on one side surface of each metal plate, and curing sealing glue at normal temperature.
  • 专利号:   CN113380643-A, CN113380643-B
  • 发明人:   HUANG Z, YAN P, WANG G, ZHANG J, SHENG B, WANG N
  • 专利权人:   JINAN BAIXIANG TECHNOLOGY DEV CO LTD
  • 国际专利分类:   H01L021/56, H01L023/10, H01L023/16, H01L023/31
  • 专利详细信息:   CN113380643-A 10 Sep 2021 H01L-021/56 202178 Pages: 10 Chinese
  • 申请详细信息:   CN113380643-A CN10596900 31 May 2021
  • 优先权号:   CN10596900

▎ 摘  要

NOVELTY - The technique involves preparing a packaging shell and two metal plates. An insulating coating is sprayed on one side surface of each metal plate. The sealing glue is used to adhere the two metal plates to two sides of graphene chip. A chip main body is formed by the metal plate and graphene chip into a cavity of the packaging shell. The sealing material is filled between the chip main body and packaging shell. A wire is welded at one end of graphene chip located outside the packaging shell. The sealing glue is used to cover a welding point. The sealing glue is cured at normal temperature, where the metal plate is an aluminum plate. USE - The technique is useful for manufacturing graphene chip packaging structure. ADVANTAGE - The technique: makes the heat conduction on both sides of graphene chip more uniform, and heating film is not easy to burn out; ensures safety protection of chip; improves insulation performance; utilizes two aluminum sheets filled with environmentally friendly ceramic glue and high-temperature insulating paint to extrude heating film in middle position; has simple structure; and is convenient to operate. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a packaging structure of graphene chip. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic representation of the manufacturing technique of graphene chip packaging structure.