▎ 摘　　要

NOVELTY - High retention rate multi-size particle strengthening low-temperature composite solder for electronic packaging, comprises micron, submicron, nano-sized reinforced particles and a low temperature brazing filler metal matrix alloy. The reinforcing particles are Mo particles, copper particles, silicon carbide particles, aluminum oxide particles, TiO2 particles, graphene, carbon nanotubes, etc., and the low-temperature solder matrix is tin-based solder, indium-based solder, and insulating solder. USE - High retention rate multi-size particle strengthening low-temperature composite solder is used for electronic package for power generation, transmission, storage, circuit control and conversion of higher requirement. ADVANTAGE - The alloy brazing filler metal solves the miniaturization and high power density of the power device, the inner welding point of the current load is high, trigger welding point is too early failure, and improves the welding joint strength and the welding point electromigration resistance. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: preparing the high retention rate multi-size particle strengthening low-temperature composite solder; Sn-Cu-Mo high-retention multi-size particle reinforced low-temperature composite solder.