▎ 摘　　要

NOVELTY - Preparing ultra-high heat conducting graphene film comprises (i) using graphene oxide slurry as precursor to prepare graphene oxide film, (ii) thermally reducing the graphene oxide film in vacuum or inert atmosphere, and removing non-carbon atoms, (iii) performing chemical vapor deposition treatment to the reduction-oxidation graphene film, introducing organic carbon source gas high temperature cracking, and depositing the gaseous carbon atom to the surface of the graphene oxide film and (iv) graphitizing the obtained graphene oxide film at high temperature in vacuum or inert atmosphere. USE - The graphene film is useful in the field of horizontal temperature equalization of electronic device. ADVANTAGE - The graphene film: has a bulk density of 1.8-2.2 g/cm3, and a thermal diffusion coefficient of 914.3-1071.5 mm2/s, thermal conductivity reaching 1168.5-1637.7 W/mK, fewer pores and high compactness, and higher thermal conductivity.