▎ 摘　　要

NOVELTY - The structure has a graphene support plate whose two sides are formed with a re-wiring layer. A dielectric layer is formed between the graphene support plate and the re-wiring layer. A graphene carrier plate is penetrated with a copper column. The re-wiring layer is connected with a copper column. A chip is arranged above the graphite carrier plate. The re-wiring layer is formed on the graphite carrier plate connected with a bump of a chip. The re-wiring layer is formed below the graphene support plate connected with a solder ball. A plastic package layer is coated at an outer side of the chip. A heat dissipation module is arranged on the plastic package layer. USE - High heat-dissipation fan-out type package structure. ADVANTAGE - The structure has high heat dissipation density. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a high heat-dissipation fan-out type packaging method. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of a high heat-dissipation fan-out type package structure.