• 专利标题:   Graphene far-infrared floor heating brick comprises brick unit laid back and forth and connecting member installed between adjacent brick units comprising bottom brick and panel set from bottom to top, and graphene heat conduction component.
  • 专利号:   CN111042481-A
  • 发明人:   DAI M
  • 专利权人:   DAI M
  • 国际专利分类:   C04B033/135, C04B038/00, E04F015/02, E04F015/18, H05B003/14, H05B003/34
  • 专利详细信息:   CN111042481-A 21 Apr 2020 E04F-015/02 202037 Pages: 10 Chinese
  • 申请详细信息:   CN111042481-A CN11401440 30 Dec 2019
  • 优先权号:   CN11401440

▎ 摘  要

NOVELTY - Graphene far-infrared floor heating brick comprises a brick unit (1) laid back and forth and a connecting member (2) installed between adjacent brick units. The brick unit has a bottom brick (12) and a panel (11) from bottom to top. The bottom brick includes a bottom frame (120) and a graphene heat conduction component. The graphene heat conducting component is provided in the recess. The graphene heat conduction component is provided with a heat generating film, and a heat conduction surface. The panel has a surface layer. The bottom surface of the surface layer is provided with grooves. A thermally conductive brick layer is bonded in the groove. A socket is provided on the side of the bottom brick. The heating film is connected to the socket by using wires. The lower part of a trapezoidal inclined surface is provided with a plug block matched with the socket, and the plug blocks on both sides are made of connected copper materials. USE - Used as graphene far-infrared floor heating brick. ADVANTAGE - The brick: has excellent heat dissipation effect, and simple laying and splicing operation; and is highly safe. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic representation of the graphene far-infrared floor heating brick. Brick unit (1) Connecting member (2) Panel (11) Bottom brick (12) Bottom frame (120)