▎ 摘　　要

NOVELTY - The device has a semiconductor heating element (2) connected with a power supply unit (1) and fixed with a semiconductor heating plate. The heating plate is fixed with a heat end part (21) and a cold end part (22). A P-type semiconductor and an N-type semiconductor are respectively arranged between the heat end part and the cold end part. A metal conductor is connected with the power supply unit that is connected with positive and negative electrodes. The P-type semiconductor and the N-type semiconductor are made of graphene material. The cold end part is fixed with a defrosting unit (5). USE - Semiconductor heating device. ADVANTAGE - The device improves heating ability and efficiency. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a semiconductor heating device. Power supply unit (1) Semiconductor heating element (2) Defrosting unit (5) Heat end part (21) Cold end part (22)