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  • 专利标题:   Copper-copper low-temperature bonding method involves using composite of copper nanoparticles, tin nanoparticles and graphene micro sheets as bonding material to realize bonding of two copper-plated substrates at low temperature.
  • 专利号:   CN111916344-A
  • 发明人:   YANG W, YIN X, JIANG X
  • 专利权人:   UNIV HEFEI TECHNOLOGY
  • 国际专利分类:   H01L021/18, H01L023/00
  • 专利详细信息:   CN111916344-A 10 Nov 2020 H01L-021/18 202097 Pages: 7 Chinese
  • 申请详细信息:   CN111916344-A CN10942868 09 Sep 2020
  • 优先权号:   CN10942868

▎ 摘　　要

NOVELTY - Copper-copper low-temperature bonding method involves using composite of copper nanoparticles, tin nanoparticles and graphene micro sheets as bonding material to realize the bonding of two copper-plated substrates at low temperature. USE - Copper-copper low-temperature bonding method. ADVANTAGE - The method is simple, reliable and economical, and has high value of industrial utilization.