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  2. 国际专利信息
  • 专利标题:   Resin plating comprises forming a graphene thin layer on a resin substrate and electroplating the resin substrate having the graphene thin layer formed on it.
  • 专利号:   EP2388355-A1, JP2011241479-A, US2011284388-A1, KR2011127018-A, CN102251233-A, EP2388355-B1, KR1537638-B1, JP5774367-B2
  • 发明人:   BAE A H, SON S I, NAM J D, LEE J H, HWANG T S, OH J S, LEE H, EAH H B, SANG I S, JAE D N, JOON S O, JUN H L, TAE S H, HWANG T, LEE J, NAN J, PAE A, SUN S, OU J
  • 专利权人:   SAMSUNG ELECTRONICS CO LTD, SAMSUNG ELECTRONICS CO LTD, SAMSUNG ELECTRONICS CO LTD, SAMSUNG ELECTRONICS CO LTD, SAMSUNG ELECTRONICS CO LTD, SAMSUNG ELECTRONICS CO LTD
  • 国际专利分类:   C23C018/16, C23C018/20, C23C018/31, C23C018/40, C25D005/10, C25D005/56, C01B031/02, C23C028/00, B82Y040/00, B82Y099/00, C25D005/54, C23C014/02, C23C026/02
  • 专利详细信息:   EP2388355-A1 23 Nov 2011 C25D-005/10 201178 Pages: 17 English
  • 申请详细信息:   EP2388355-A1 EP161501 07 Apr 2011
  • 优先权号:   KR046626

▎ 摘　　要

NOVELTY - Resin plating comprises: (a) forming a graphene thin layer on a resin substrate; and (b) electroplating the resin substrate having the graphene thin layer formed on it. It also comprises forming amine groups on a surface of the resin substrate before applying graphene oxide dispersion to the resin substrate. USE - The method is used for resin plating (claimed). ADVANTAGE - The method provides an eco-friendly plating method which includes use of graphene having high adhesion to a resin as well as high conductivity, to considerably reduce the number of individual processes in etching and activation stages and to enable formation of a plating film. DESCRIPTION OF DRAWING(S) - The drawing shows a flowchart of the method for resin plating.