• 专利标题:   High heat-conducting ternary polymer composite material useful in e.g. integrated circuit comprises organic polymer matrix unit and filler unit dispersed and filler unit has one-dimensional nano tube/wire, on which two-dimensional nano materials are grown in situ or physically mixed.
  • 专利号:   CN115594948-A
  • 发明人:   YAN C, LI Y
  • 专利权人:   LANZHOU CHEM PHYSICS INST CHINESE ACAD
  • 国际专利分类:   C08K003/02, C08K003/08, C08K003/30, C08K003/38, C08K007/00, C08L101/00, C08L063/00
  • 专利详细信息:   CN115594948-A 13 Jan 2023 C08L-063/00 202317 Chinese
  • 申请详细信息:   CN115594948-A CN11387859 07 Nov 2022
  • 优先权号:   CN11387859

▎ 摘  要

NOVELTY - High heat-conducting ternary polymer composite material comprises an organic polymer matrix unit and a filler unit dispersed. The filler unit is one-dimensional nano tube/wire as framework, on which two-dimensional nano materials are grown in situ or physically mixed and metal materials are dotted on the two-dimensional nano material. The mass ratio of the one-dimensional nanotube/wire, two-dimensional nanomaterial and the metal material is 1:1-90:1-50. USE - The material is useful in integrated circuit, microprocessor, radiating fin and soaking sheet. ADVANTAGE - The material is featured with good preparation; has good heat conducting effect and strong characteristics. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing high heat-conducting ternary polymer composite material comprising (a) performing surface hydrophilic treatment to the one-dimensional nano-tube/wire, mixing with the two-dimensional nano-material, uniformly dispersing into the deionized water, reacting by hydrothermal method or solvothermal method to obtain heat conductive filler products, adding metal materials to the heat conductive filler products, depositing by electrochemical method or photo deposition method to obtain the filler unit, (b) grinding the filler unit to a powder with a particle size not higher than 30 µm, (c) mixing 3-12% filler unit powder, 3-12% curing agent, 75-93% organic polymer matrix unit and 1-4% catalyst to obtain slurry and (d) coating the slurry on the copper plate substrate, curing at 100-120℃ for 1-2 hours, then at 160-200℃ for 1-2 hours, cooling to room temperature and removing the copper plate substrate to obtain high heat-conducting ternary polymer composite material.