• 专利标题:   Device for cutting graphene, includes reception to receive graphene, cutting element loaded with catalytically active material in cutting edge area, device to displace reception and cutting element with the cutting edge, and heating device.
  • 专利号:   DE102008053691-B3, WO2010048940-A1, US2011266326-A1
  • 发明人:   KIRSTEIN S, RABE J P, SEVERIN N, RABE J
  • 专利权人:   UNIV BERLIN HUMBOLDT, UNIV BERLIN HUMBOLDT, RABE J P, SEVERIN N, KIRSTEIN S
  • 国际专利分类:   D01F009/12, C01B031/04, G01Q080/00, H01L021/00, B26F003/00
  • 专利详细信息:   DE102008053691-B3 21 Jan 2010 D01F-009/12 201010 Pages: 12 German
  • 申请详细信息:   DE102008053691-B3 DE10053691 29 Oct 2008
  • 优先权号:   DE10053691

▎ 摘  要

NOVELTY - The cutting device comprises a reception (10) to receive graphene (19) for cutting, a cutting element (12) loaded with a catalytically active material in an area of a cutting edge, a displacement device to displace the reception and the cutting element with the cutting edge relative to each other, and a heating device (14) to provide heat energy for catalytic reaction of graphene in the area of a cutting path under participation of the active material. The active material is disposed on a surface of the cutting edge. The cutting edge is made of the active material in a section-wise manner. USE - Cutting device for cutting graphene, which is useful for manufacturing electronic circuits, where the graphene is present in the form of nanotubes. ADVANTAGE - The cutting device is capable of precisely, economically and flexibly cutting the graphene with a predetermined formation and high speed. DETAILED DESCRIPTION - The cutting device comprises a reception (10) to receive graphene (19) for cutting, a cutting element (12) loaded with a catalytically active material in an area of a cutting edge, a displacement device to displace the reception and the cutting element with the cutting edge relative to each other, and a heating device (14) to provide heat energy for catalytic reaction of the graphene in the area of a cutting path under the participation of the active material. The active material is disposed on a surface of the cutting edge. The cutting edge is made of the active material in a section-wise manner. The cutting element is formed with a tip of a probe microscope. The catalytically active material comprises silver particle or tungsten particle. The heating device is configured to adjust a reaction temperature of 650-800 degrees C for the catalytic reaction by using the heat energy, and comprises a laser as heating agent. An INDEPENDENT CLAIM is included for a method for cutting graphene using a cutting device. DESCRIPTION OF DRAWING(S) - The diagram shows a schematic view of a cutting device for cutting graphene. Reception (10) Cutting element (12) Heating device (14) Graphene (19) Substrate. (20)