▎ 摘　　要

NOVELTY - Improving warping of copper-clad ceramic substrate motherboard comprises (i) adding isophorone diisocyanate into N,N-dimethylformamide solution of graphite oxide, reacting, adding hydrazine hydrate, centrifuging and washing with N,N-dimethylformamide solution, (ii) dissolving the modified graphene in water, mixing with hollow glass microbeads and titanium dioxide, washing and drying, (iii) ball-milling and drying the modified hollow glass microbeads with ethanol and microfibers, ultrasonically reacting with ethanol solution, adding modifier, reacting, filtering and drying, (iv) mixing composite hollow glass microbeads with nickel sulfate, nickel chloride, boric acid, sodium citrate and water, (v) ultrasonically cleaning ceramic substrate in acetone, ethanol, and water and ultrasonically cleaning in a mixed solution of sulfuric acid and sodium thiosulfate, (vi) electroplating nickel layers, cleaning, and drying, and (vii) coating solder, fixing copper foil, brazing, and etching. USE - Method for improving warping of copper-clad ceramic substrate motherboard. ADVANTAGE - The method enables to improve warping of copper-clad ceramic substrate motherboard motherboard, which solves the problem that the copper and ceramic heat expansion coefficient is not matched and the two sides of copper thickness is not consistent caused by copper clad ceramic substrate, satisfies the use requirement of the product, and has simple nickel plating process, will not generate pollution, the setting of the nickel layer makes the bonding force of the solder pattern and the ceramic substrate better, the connection is better and stable, convenient for subsequent etching and so on. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view showing the structure of a nickel-plated ceramic substrate and a copper foil. Nickel-plated ceramic substrate (1) Solder adjusting area (2) Solder functional area (3)