▎ 摘　　要

NOVELTY - Plug hole resin with low temperature resistance and high thermal conductivity comprises 23-35 pts. wt. epoxy resin, 15-30 pts. wt. reactive diluent, 2-6 pts. wt. latent curing agent, 0.1-1 pts. wt. imidazole curing accelerator, 0.01-0.1 pts. wt. defoaming agent and 40-60 pts. wt. filler. The epoxy resin is the mixture of bisphenol A epoxy resin and bisphenol F epoxy resin in a mass ratio of 2-4:1. The reactive diluent is a mixture of dipropylene glycol diglycidyl ether and 1,2-cyclohexanediol diglycidyl ether in mass ratio of 1:1-3. The latent curing agent is the mixture of methyl nadic acid anhydride and aliphatic polyanhydride in mass ratio of 3-5:1. The imidazole-type curing accelerator is 2-methylimidazole or its derivatives, imidazole metal salt complex, 2-ethyl-4-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-undecylimidazole and/or 2-heptadecylimidazole. USE - The plug hole resin is useful in circuit board production technology field, e.g. deep sea, deep space and polar detection field. ADVANTAGE - The plug hole resin has excellent thermal conductivity, low temperature mechanical property, insulating property, and low curing temperature, and is suitable for special working environment like low temperature and humidity. DETAILED DESCRIPTION - Plug hole resin with low temperature resistance and high thermal conductivity comprises 23-35 pts. wt. epoxy resin, 15-30 pts. wt. reactive diluent, 2-6 pts. wt. latent curing agent, 0.1-1 pts. wt. imidazole curing accelerator, 0.01-0.1 pts. wt. defoaming agent and 40-60 pts. wt. filler. The epoxy resin is the mixture of bisphenol A epoxy resin and bisphenol F epoxy resin in a mass ratio of 2-4:1. The reactive diluent is a mixture of dipropylene glycol diglycidyl ether and 1,2-cyclohexanediol diglycidyl ether in mass ratio of 1:1-3. The latent curing agent is the mixture of methyl nadic acid anhydride and aliphatic polyanhydride in mass ratio of 3-5:1. The imidazole-type curing accelerator is 2-methylimidazole or its derivatives, imidazole metal salt complex, 2-ethyl-4-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-undecylimidazole and/or 2-heptadecylimidazole. The filler is a mixture of boron nitride nanotubes, graphene, and modified micron-level silica. The sum of the graphene and boron nitride nanotubes accounts for 1-5% of the mass of the low temperature resistant and high thermal conductivity plug hole resin. INDEPENDENT CLAIMS are also included for: preparing the plug hole resin with low-temperature resistant and high thermal conductivity comprising (a) heating the epoxy resin and active diluent to 60-90℃, stirring and mixing, (b) continuously adding defoaming agent, latent curing agent and imidazole curing accelerator, mixing uniformly, (c) continuously adding filler, stirring and mixing to obtain the resin mixture and (d) grinding the resin mixture, vacuum stirring and degassing to obtain the plug hole resin; and a resin plugging method comprising plugging the circuit board by using the low temperature resistant high thermal conductivity plugging resin, pre-curing at a temperature of 100-130℃ and a curing time of 20-60 minutes, carrying out the secondary curing out under the conditions of a temperature of 150-180℃ and a curing time of 60-120 minutes.