• 专利标题:   Thermally conductive complex material comprises e.g. graphene enriched at the surface of the thermoplastic micro-particles and the thermoplastic micro-particles is dispersed in resin base, further comprising thermoplastic micro-particles.
  • 专利号:   CN106977882-A, CN106977882-B
  • 发明人:   LI G, WU D, YANG X, LI B
  • 专利权人:   UNIV BEIJING CHEM TECHNOLOGY, UNIV BEIJING CHEM TECHNOLOGY
  • 国际专利分类:   C08G059/50, C08K003/04, C08L061/16, C08L063/00, C08L077/00, C08L079/08
  • 专利详细信息:   CN106977882-A 25 Jul 2017 C08L-063/00 201759 Pages: 6 Chinese
  • 申请详细信息:   CN106977882-A CN10316963 08 May 2017
  • 优先权号:   CN10316963

▎ 摘  要

NOVELTY - Thermally conductive complex material comprises graphene and resin base, further comprises thermoplastic micro-particles, where the graphene is enriched at the surface of the thermoplastic micro-particles and the thermoplastic micro-particles is dispersed in the resin base, the mass ratio of the components including graphene, thermoplastic microparticles and (resin matrix and curing agent) is (0.5-5):(5-10):(94.5-85). USE - Used as thermally conductive complex material. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing heat-conducting complex material comprising (a) adding reduced graphene dispersed in the low boiling point organic solvent, stirring uniformly, adding thermoplastic micro-particles, adjusting the pH value to 6-9 with buffer solution, stirring to promote graphene thermoplastic micro-particles with the electrostatic absorption, to obtain stable self-assembled mixed filler suspension, where the mass ratio of reduced graphene and thermoplastic micro-particles is 1:(2-10), (b) adding the suspension, stirring uniformly, adding curing system, mixing evenly, removing the solvent by vacuum in the resin matrix, heating based on the curing system, to obtain thermally conductive resin-based complex material, where the mass ratio of (resin matrix and curing system) and self-assembling filler is (94.5-85):(5.5-15).