▎ 摘　　要

NOVELTY - The circuit has an insulating substrate (1) and an integrated circuit chip (2). The surface of the insulating substrate is provided with a metal bonding area (3) and a ceramic frame (4). The integrated circuit chip is packaged in the ceramic frame. The integrated circuit chip is bonded in the metal bonding area through a metal bonding wire (5). The surface of the insulating substrate is coated with an anti-interference coating. The insulating substrate comprises a heat dissipation assembly. The heat dissipation assembly is mounted above the insulating substrate. The heat dissipation assembly comprises a left upright post, a right upright post, an installation frame and multiple heat dissipation fans. The left upright post and the right upright post are respectively erected on the insulating substrate. USE - Anti-interference anti-corrosion semiconductor integrated circuit. ADVANTAGE - The anti-interference and anti-corrosion semiconductor integrated circuit has simple structure, convenient manufacturing, excellent anti- interference, anti corrosion performance, and good radiating effect, which can ensure the use performance of the integrated circuit chip. The radiating assembly can quickly dissipate the heat generated when the IC chip is working, thus ensuring the working performance of IC chip. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for manufacturing anti-interference and anti-corrosion semiconductor integrated circuit. DESCRIPTION OF DRAWING(S) - The drawing shows a top view of an anti-interference anti-corrosion semiconductor integrated circuit. Insulating substrate (1) Integrated circuit chip (2) Metal bonding area (3) Ceramic frame (4) Metal bonding wire (5)