• 专利标题:   Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.
  • 专利号:   US2021265075-A1, WO2021173408-A1, TW202202570-A, CN115151607-A, KR2022146567-A, EP4110868-A1, JP2023514820-W
  • 发明人:   KIM Y S, JIN R
  • 专利权人:   TICONA LLC, TICONA LLC, TICONA LLC
  • 国际专利分类:   H05K003/10, H05K009/00, H05K001/09, H01B001/12, C08L067/04, H05K001/18, H05K003/00, H05K003/12, H05K003/20, H05K003/24, C08G063/06, C08G063/60, C08K003/04, C08K003/34, C08L101/00, H05K001/03
  • 专利详细信息:   US2021265075-A1 26 Aug 2021 H01B-001/12 202181 English
  • 申请详细信息:   US2021265075-A1 US178292 18 Feb 2021
  • 优先权号:   US981667P, US057345P, US178292, CN80016983, KR733165

▎ 摘  要

NOVELTY - Electronic device (22) has: a singulated carrier portion; a substrate molded onto the singulated carrier portion, where the substrate comprises a polymer composition that includes an aromatic polymer and an electrically conductive filler, where the polymer composition exhibits a surface resistivity of 1x1012 ohms to 1x1018 ohms as determined in accordance with ASTM D257-14; and conductive traces disposed on the substrate. USE - The electronic device includes printed circuit board, flex circuit, connector, thermal management feature, electromagnetic interference (EMI) shielding, high current conductor, radio-frequency identification (RFID) apparatus, antenna, wireless power device, sensor, microelectromechanical systems (MEMS) apparatus, LED device, microprocessor, memory device, application-specific integrated circuit (ASIC), passive device, impedance control device, and electro-mechanical apparatus. ADVANTAGE - The device has excellent strength properties, exhibit a high dielectric constant of 4 or more, and maintains the dielectric constant and dissipation factor. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method of forming the electronic device, comprising molding the substrate onto a carrier, forming a seed layer on the substrate, and depositing a metal on the seed layer to form conductive traces. DESCRIPTION OF DRAWING(S) - The drawing shows a perspective view of the electronic device in the form of an automotive light. Light (20) Electronic device (22) Housing (24) Light pipe (28) Passageway (34)