▎ 摘　　要

NOVELTY - The device (10) has a heat sink base (12) and heat sink fins (14) comprising a single element formed from a set of graphene layers with carbon nanotubes interposed between the graphene layers. The heat sink base comprises a pedestal (16) for direct contact with an integrated circuit package. The integrated circuit package comprises a lidless integrated circuit package. A frame is mounted on a printed circuit board and supporting the heat sink base. The frame comprises shock absorbing material. Side walls extend upward from the frame and positioned adjacent to the heat sink fins. USE - Graphene and carbon nanotube based thermal management device. ADVANTAGE - The device has high thermal management performance, and reduces energy use resulting in greater heat dissipation from components, and improves performance of high power components i.e. application specific integrated circuits (ASICs). DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a graphene and carbon nanotube based thermal management method. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a graphene and carbon nanotube based thermal management device. Graphene and carbon nanotube based thermal management device (10) Heat sink base (12) Heat sink fins (14) Pedestal (16)