▎ 摘　　要

NOVELTY - The embodiment of the invention claims a graphene composite semiconductor electric heating element ultrasonic atomizing spray plating furnace, comprising a heating box body, the heating box body is provided with a heating space at one side. The graphene composite semiconductor electric heating element ultrasonic atomizing spray plating furnace, the upper part in the heating space is fixedly connected with an ultrasonic atomizing movable slide rail, and the upper part is movably connected with an ultrasonic atomizing machine, so that the ultrasonic atomizing machine at the controller terminal controls to make it move back and forth on the ultrasonic atomizing moving slide rail, so that in the using process, the ultrasonic atomizing nozzle can quickly spray plating for the processing work piece; the spraying speed is slow during the common spraying plating process, and the time period is long, The ultrasonic atomizing movable slide rail is fixedly installed in the inner part, so that the ultrasonic atomizing nozzle can quickly spray plating work to the surface of the processed work piece, so that the efficiency is improved and the practicability is enhanced.