▎ 摘　　要

NOVELTY - Preparing hollow micro-sphere composition heat-conducting filler covered by low-dimensional nano-high heat-conducting material comprises covering the low-dimensional nano-high heat-conducting material on the surface of the micron hollow spherical particle through strong interaction includes electrostatic interaction, chemical bond action and solvent hydrogen bond interaction, where the mass ratio of the low-dimensional nanometer high heat-conducting material and micron hollow spherical particles is 1:5-1:100. USE - The hollow micro-sphere composition heat-conducting filler covered by the low-dimensional nano-high heat-conducting material is useful in heat-conducting aspect. ADVANTAGE - The method realizes the tight combination of low-dimensional nano high heat conducting material and micron hollow spherical particles. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for: hollow micro-sphere composition heat-conducting filler covered by the low-dimensional nano-high heat-conducting material prepared by above method.