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  • 专利标题:   Component carrier comprises component embedded in stack and has curved surface portion, conductive contact element in contact with curved surface portion of embedded component, where stack comprises electrically insulating layer structure.
  • 专利号:   US2021068252-A1, EP3790365-A1, CN112447659-A
  • 发明人:   STAHR J, ZLUC A, MOITZI H, MOIZY H
  • 专利权人:   AT S AUSTRIA TECHNOLOGIE SYSTEMTECHN, AT S AUSTRIA TECHNOLOGIE SYSTEMTECHN, AT S AUSTRIA TECHNOLOGIES SYSTEM TEC
  • 国际专利分类:   H05K001/03, H05K001/11, H05K001/18, H05K003/22, H05K003/00, H01L021/48, H01L023/367, H01L023/498, H05K001/02, H05K003/32
  • 专利详细信息:   US2021068252-A1 04 Mar 2021 H05K-001/03 202134 English
  • 申请详细信息:   US2021068252-A1 US008213 31 Aug 2020
  • 优先权号:   EP195368

▎ 摘　　要

NOVELTY - Component carrier 1 comprises stack 2 comprising electrically insulating layer structure and electrically conductive layer structure. The component 3 is embedded in stack and having curved surface portion 4. The conductive contact element 6 is in contact with curved surface portion of embedded component. USE - Component carrier. ADVANTAGE - The component carrier improves quality, contact stability, thermal and electrical conductivity and thermal properties. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for manufacturing component carrier, which involves: a. providing stack comprising electrically insulating layer structure and electrically conductive layer structure; b. embedding component in stack, component having curved surface portion; c. forming recess in stack to expose portion of curved surface portion of component; d. filling recess partially with conductive material to form conductive contact element extending up to curved surface portion of component. DESCRIPTION OF DRAWING(S) - The drawing shows schematic view of component carrier. Component carrier (1) Stack (2) Component (3) Curved surface portion (4) Conductive contact element (6)