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  • 专利标题:   Adhesive composition useful for heat radiating in electronic components, comprises polyamide resin and graphene or metal powder.
  • 专利号:   KR2014144576-A
  • 发明人:   SANG T O, JU P H, JONGHYEOK P, SUNG J L
  • 专利权人:   KOREA INST FOOTWEAR LEATHER TECHNOLO
  • 国际专利分类:   C09J177/00, C09J009/00
  • 专利详细信息:   KR2014144576-A 19 Dec 2014 C09J-177/00 201503 Pages: 9
  • 申请详细信息:   KR2014144576-A KR066711 11 Jun 2013
  • 优先权号:   KR066711

▎ 摘　　要

NOVELTY - Adhesive composition comprises 100 pts. wt. polyamide resin and 10-300 pts. wt. graphene or metal powder. USE - The composition is useful for heat radiating in electronic components (claimed), preferably light-emitting diode heating element and in semiconductor devices. ADVANTAGE - The composition has excellent heat radiating, adhesive, physical and chemical properties, extends life of electronic components and electronic products, and is economical.